The data obtaind from dielectric cure monitoring evidence shows that:
Cure Time Decreases with Increasing Temperature, As Predictd for a Thermally Industrial.
Critical Points DTECT Typical Features of the Cure Like The Maximum Slope of Log (ION VISCOSITY), Minimum ION VISCOSITY, and the Time Taken for a Selected End of Cure.
And the time taken for a selectd of cure.
FREQUENCY-Independent (σdc) Components.
σ = σdc + σac
(OHM & Minus; 1 & NDASH; CM & Minus; 1)
(EQ. 1)
Residivity (ρ), which is the inferse of conductivity, can be defined as:
ρ = 1/σ
(OHM-CM)
(EQ. 2)
IV = ρDC
(OHM-CM)
(EQ. 3)
DEPENDENT (cac) Component. But it must be noted that measurement visits and cure standing releated to firePependent resision, ρ happer to be the trowality my
SMC SAMPLES Were Placement on Mini-Varicon2 Sensors, as Illustrated in Figure 1, With the Lay-Up of Figure 2.
Figure 1. Mini-Varicon Disposable Sensor. Image Credit: Lambient Technologies.
FIGURE 2. Lay-up of SMC for Cure Monitoring. Image Credit: Lambient Technologies.
SAMPLE CURING WAS DONE IN A Laboratory Press at 135 ° C, 145 ° C and 155 ° C. Prior testable that 10 Hz is an optimum expory monitoring.
Which Also Carried Out Presentation and Post-Analysis of the Results.
FIGURE 3. 135 ° C Smc Cure Data at 10 Hz. Image Credit: Lambient Technologies.
FIGURE 4. 145 ° C Smc Cure Data at 10 Hz. Image Credit: Lambient Technologies.
FIGURE 5. 155 ° C Smc Cure Data at 10 Hz. Image Credit: Lambient Technologies.
Denote the End of Cure Based on the Application Requirements.
Table 1. Critical point from smc cure monitoring. Source: lambient technology.
Cure Temp. (° C)
pr (1) crit. VISC.
Cp (2) min. Visc.
Cp (3) max slope
Cp (4) crit. Slope
Value
Time
Value
Time
Value
Time
Value
Time
135
8 0
0.65 min
(39 s)
7 38
4.17 min
(250 s)
1.86
6.23 min
(374 s)
0 25
7.21 min
(433 s)
145
8.0
0.60 min
(36 s)
7.39
3.42 min
(205 S)
3.65
5.01 min
(301 s)
0.25
6.13 min
(368 s)
155
8.0
0.65 min
(39 s)
7.60
2.48 min
(149 s)
3.67
4.03 min
(242 s)
0.25
5.14 min
(308 s)
As Shown in Figure 6, The Time taken to reach Everyual Point is shorter for cures at Elevated Temperatures, which is anticipated for reactions that are thermally induced.
Figure 6. Critical Point Time Versus Cure Temperature for SMC. Image Credit: Lambient Technology.
Value was selected to demote the onset of flow. The time to flow is not a meeting but a measure of heating time; for class, CP (1) have been ben considered.
Times to Reach Both CP (3) and CP (4) Differ By An Analogous Amount with Temperature.
Simple method to define the progress of cure. Figure 7 Illustrates a Standard thermoset & rsquo; S Behavior with A Single RAMP and HOLD STEP in TEMPERATURE.
FIGURE 7. Typical ION VISCOSITY BeEHAVIOR of thermoset Cure During thermal Ramp and Hold. Image Credit: Lambient Technologies.
Figure 8. ION VISCOSITY CUREVE and SLOPE of ION VISCOSITY of theRMOSET CURING Thermal Ramp and Holdit: Image Credit: Lambient Technologies.
Four critical points, Illustrald in Figure 8, define the dielectric technology:
Cp (1) & mdash; a user-defined log (IV) level to detect the onset of material flow.
CP (2) & mDash; minimum Ion Viscosition Closely CorrelatingS with Minimum Mechaanical Viscosity, Denotion When Increassing Viscosity Start to Goven the BeHavility.
Cp (4) & mdash; A user-defined slope that defines the end of cure. The decreasing slope matches the decreasing rate of reaction.
FIGURE 9. ION VISCOSITY CUROPE of ION VISCOSITY of theRMOSOT CURE DRING ISOTHERMAL PROCESSING. Image Credit: Lambient Technologies.
CURES, Both CP (3) and CP (4) Are theoretically The Same as for Ramp and Hold Conditions.
LT-451 DIELECTRIC CURE MONITOR, Manufactured by Lambient Technologies, Cambridge, MA, USA. Https://lambient.com
Mini-Varicon Sensor, Manufactured by Lambient Technologies, Cambridge, MA, USA, USA, USA
CureView Software, Manufactured by Lambient Technologies, Cambridge, Ma, USA, USA, USA
This information BMC MOLDING ManuFactureer has ben BMC MOLDING ManuFacturer Sourced, Reviewed and Adapted from Materials Provided TechNologies.